FOOD PACK & TECH Shanghai | Trade fair for food packaging and technologies
Food Pack & Tech is a renowned trade fair focusing on food packaging and technology, held annually in Shanghai. It brings together leading companies, manufacturers, and suppliers from the food packaging and processing industry and provides a platform to present innovative solutions, products, and services. As part of the WEPACK exhibition family, which also includes SinoCorrugated, SinoFoldingCarton, SinoFlexPack, PACKCON, DPrint, and SinoPaper, it is one of the most significant events in Asia focused on food packaging and technologies. It attracts a variety of trade visitors from various industries, including food and beverage manufacturers, retailers, packaging designers and developers, as well as distributors and suppliers.
The FOOD PACK & TECH in Shanghai took place from Wednesday, 12. July to Friday, 14. July 2023.
Cycle:
annually
Fair location:
NECC National Exhibition and Convention Center,228 Pan Zhong Dong Lu Qingpu Qu, Shanghai, Shanghai, China
Hotels
for trade fair date in Shanghai
Reed Exhibitions (China) Ltd.
42nd floor, Intercontinental Center, 100 Yutong Road, Zhabei District
Shanghai, China
Display e-mail address
www.reedexpo.com.cn
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12. – 14. July 2023
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13. – 15. July 2022
Product groups: conveyor systems, fillers, foreign body detectors, homogenizers, labelers, packaging machines, packaging materials, palletizing robots, pasteurizers, sealers, sorting systems, sterilizers, vacuum sealers, weighing systems, X-ray inspection systems, …
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