PACKCON Shenzhen 10. – 12. April 2024 | Trade fair for packaging materials

The PACKCON is an international trade fair for packaging materials and products, which takes place annually in Shanghai. As an important platform for the packaging industry, it attracts thousands of trade visitors and exhibitors from all over the world. The show is organized by Reed Exhibitions Ltd. and is part of the WE-PACK trade fair network, which, in addition to PACKCON, also includes SinoCorrugated, SinoFlexPack, FOOD PACK & TECH, DPrint, SinoPaper, and SinoFoldingCarton.

A variety of packaging solutions, materials, machines, and technologies will be presented at PACKCON, including carton packaging, plastic packaging, flexible packaging, labels, and marking systems, as well as innovative packaging designs. The fair also offers a platform for the presentation of packaging machines and systems, such as filling and sealing machines, cutting and winding machines, as well as printing and laminating systems. It is an important meeting place for professionals from the packaging industry to establish business relationships, exchange information on the latest trends and developments, and discuss the current challenges and opportunities in the packaging sector. PACKCON has become a major event for the packaging industry, helping to promote innovation and growth in this sector, particularly in China and the Asian region.

The PACKCON will take place on 3 days from Wednesday, 10. April to Friday, 12. April 2024 in Shenzhen.